1. 2. 3. material content data sheet sales product name idd09sg60c issued 29. august 2013 ma# MA000809454 package pg-to252-3-311 weight* 312.16 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip noble metal gold 7440-57-5 0.131 0.04 420 non noble metal tin 7440-31-5 0.034 0.01 108 inorganic material silicon 7440-21-3 1.670 0.53 0.58 5349 5877 leadframe non noble metal iron 7439-89-6 0.162 0.05 521 inorganic material phosphorus 7723-14-0 0.049 0.02 156 non noble metal copper 7440-50-8 162.275 51.99 52.06 519847 520523 wire non noble metal aluminium 7429-90-5 0.905 0.29 0.29 2899 2899 encapsulation organic material carbon black 1333-86-4 1.431 0.46 4584 plastics epoxy resin - 25.044 8.02 80227 inorganic material silicondioxide 60676-86-0 116.632 37.36 45.84 373630 458442 leadfinish non noble metal tin 7440-31-5 3.740 1.20 1.20 11981 11981 plating non noble metal nickel 7440-02-0 0.086 0.03 277 inorganic material phosphorus 7723-14-0 0.000 0.00 0.03 1 278 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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